Develop and optimize dry and wet lamination and assembly processes
Operate lamination processes (hotmelt, adhesives, UV/thermal curing)
Develop encapsulation and coating stacks
Select and qualify materials for production
Apply and optimize protective coatings and encapsulation layers for environmental and mechanical protection.
Ensure electrical and mechanical robustness of the final product
Troubleshoot lamination and interconnection defects
Perform scale-up to production
Develop SOPs, work instructions, and process documentation for lamination and assembly operations.
BS or MS in Engineering or related field
Minimum 5 years of experience in lamination ideally with flexible electronics manufacturing.
Hands-on experience with thin-film device lamination and encapsulation.
Experience with flexible substrates and R2R systems
Familiarity with lamination materials such as adhesives, barrier films, and protective coatings.
Ability to work closely with production, quality, and equipment teams in a manufacturing environment.
Experience with UV resistant encapsulation materials.
Background in lightweight, flexible electronics.
Familiarity with failure modes related to lamination, delamination, cracking, or interconnect fatigue.