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Updated 2026-06-16 06:00 UTC·© 2025–2026 RoleSuite
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Wafersort Process Engineer (R&D Engineer Hardware)

Broadcom · Malaysia-Penang B 1 & 2

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Job Description:

Job Description:

  • Central technical liaison / Primary interface between internal team (RND/NPI/Packaging/QA) and wafer sort CM.
  • Work closely with wafer sort CM on process development / improvement and process defect related activities.
  • Managing other wafer sort CM related activities.
  • Able to work independently with minimum supervision and set appropriate priorities to ensure timely delivery.

Minimum Requirement:

  • Bachelor/Master/PhD degree (or equivalent qualification) in Electrical/Electronic engineering.
  • Minimum 5 years (preferably 8 years)working experience in wafer foundry / wafer sort process related fields.
  • In-depth process knowledge on process like bumping, dicing, backgrind, tape & reel…
  • Able to speak fluently in Chinese & English.
  • Skills on data analysis / programming / AI are added advantages.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Hardware pay context

Based on 2,308 disclosed Hardware salaries on RoleSuite, the role pays a median of $135K/year, with most offers between $109K and $171K (10th–90th percentile: $91K–$207K).

See the full Hardware salary breakdown →
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