Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $163000 - $237000 (USD) + 15% bonus target + bonus + equity + benefits
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benefits at Google.
Minimum qualifications:
- Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
- 5 years of experience in chip package substrate design using Cadence APD (Allegro Package Designer) or Mentor Expedition with package tape-outs.
- Experience in chip package substrate layout, design rules/verification, design for manufacturing (DFM) and taping out for production.
- Experience in mobile SOC package design in the following technologies: FCCSP, Package on Package (PoP), InFO, RDL, IPD, 2.5D/3D, Chiplet.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
- Experience in package outline, package routing strategy, bump and ball grid array (BGA) assignment, netlist management.
- Experience in package design intercept of new packaging technologies and new silicon interfaces/subsystems.
- Experience in physical verification flow development (e.g., Layout Versus Schematic (LVS), Design Rule Checking (DRC), connectivity).
- Experience with CAD for creating simple mechanical drawings, such as Package Outline Drawings (POD).