Post Silicon Advanced Packaging Engineer

Google · Taipei, Taiwan

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As a Post Silicon Advanced Packaging Engineer, you will bridge the gap between post-silicon bring-up, foundry/OSAT manufacturing, and IC design. You will own the mass production yield, quality, and sustaining engineering for high-performance computing and AI products utilizing 2.5D/3D advanced packaging architectures. Your primary focus is maximizing package-level yield, resolving complex multi-die integration failures, and driving cross-functional engineering teams to optimize cost and reliability.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Minimum qualifications:

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
  • 8 years of experience with product engineering and test engineering.
  • Experience with 2.5D/3D packaging technologies, interposers, high-density substrates, and micro-bump metallurgical bonding.

Preferred qualifications:

  • Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
  • Experience evaluating customer returns, identifying assembly issues and improvement plans.
  • Experience in Python/Perl for data automation, statistical analysis, and yield management systems.
  • Understanding of high bandwidth memory integration, die-to-die interfaces, and high-speed signal integrity challenges within a package.
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