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Updated 2026-06-10 04:00 UTC·© 2025–2026 RoleSuite
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Packaging Design Engineer

Google · Sunnyvale, CA, USA

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

The Packaging Design Engineer serves as the critical technical link between advanced hardware engineering and global operations. In this role, you will lead the end-to-end structural development, mechanical validation, and technical execution of protective packaging systems designed specifically for complex, high-value, and shock-sensitive hardware infrastructure.

Operating within a changing New Product Introduction (NPI) framework, you will own the entire packaging development lifecycle from initial concept phase through to global mass production. You will cross-functionally collaborate with product designers, supply chain partners, and manufacturing facilities to translate complex product fragility requirements into highly reliable, scalable, and freight-efficient architectures.

You will bring a data-driven approach to structural design, utilizing predictive engineering tools alongside physical testing to eliminate transport risks. You will act as an internal advocate for sustainable engineering, continuously identifying opportunities to reduce carbon footprints, minimize material waste, and optimize cube utilization without ever compromising product safety. Ultimately, your work ensures that our next-generation physical infrastructure transitions seamlessly and reliably from factory floors to global deployment sites around the world.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $144000 - $209000 (USD) + 15% bonus target + bonus + equity + benefits

Learn more about benefits at Google.

Minimum qualifications:

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, a related engineering field, or equivalent practical experience.
  • 8 years of experience in hardware product packaging and structural design.

Preferred qualifications:

  • 8 years of experience in hardware or industrial packaging design.
  • Proven ability to work autonomously, take complete ownership of projects, and deliver results with minimal guidance.
  • Natural innovator with a track record of thinking outside-the-box to design creative solutions for complex structural, space, or material constraints.
Apply →

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