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Updated 2026-06-27 01:00 UTC·© 2025–2026 RoleSuite
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R&D Process Engineer, Advanced Bonding Process Development

Diamond Foundry · Bay Area, California

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

We are seeking an on-site R&D Process Engineer to join our AI Chips team. This role will support customer prototyping and internal process development for advanced packaging applications, with a focus on integrating single-crystal diamond with AI customer devices to demonstrate thermal and performance benefits.

The ideal candidate is a hands-on process engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.

This position will be located in our San Jose office. 

Responsibilities

  • Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits.

  • Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements.

  • Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods.

  • Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing.

  • Manage end-to-end project execution, covering schedules, technical risks, cross-functional communication, customer updates, and technical reports.

  • Requirements

  • Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field.

  • Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred.

  • Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable.

  • Strong problem-solving skills and willingness to learn new materials, tools, and processes.

  • Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.

  • Operations pay context

    Based on 4,511 disclosed Operations salaries on RoleSuite, the role pays a median of $112K/year, with most offers between $83K and $148K (10th–90th percentile: $63K–$187K).

    This posting lists $125K–$145K, above the $112K market median.

    See the full Operations salary breakdown →
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