Analog Design Engineer, Google Cloud

In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.

As a Analog Design Engineer, you are the silicon strategist, defining the architectural path from high-speed electrical interconnects to Co-Packaged Optics (CPO). You will set the technical direction for Google's silicon in the 1.6Tbps era.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $240000 - $334000 (USD) + 25% bonus target + bonus + equity + benefits

Learn more about benefits at Google.

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
• 12 years of experience in Analog/Mixed-Signal design.
• Experience with advanced packaging (2.5D/3D) and mixed-signal performance.

Preferred qualifications:

• Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Experience shipping industry-first silicon.
• Experience with the design and integration of optical interconnects and Co-Packaged Optics (CPO).
• Expertise in high-speed interconnects, with a strong record of publications, patents, or conference presentations.
• Understanding of system-level trade-offs, from device physics to network architecture in hyperscale data centers.
• Ability to influence and drive technical strategy across large, cross-functional organizations.