Hardware Engineering at HP Inc..
HP Inc. currently has 19 open hardware engineering roles, concentrated in Corvallis, Singapore and Batu Kawan (1 hybrid), spanning entry through senior levels. Apply at the source — RoleSuite links straight to HP Inc.'s official careers page, no intermediary.
Open hardware engineering roles
19 rolesDirector, Hardware Engineering & Platform Execution – HP Z WorkstationsFort Collins, Colorado, United States of AmericaPageWide Web Press CA&G Mechanical EngineerCorvallis, Oregon, United States of AmericaR&D Electrical EngineerSingapore, South West, SingaporeR&D Electrical Hardware EngineerSingapore, South West, SingaporeMEMS/ Microfluidics Design EngineerCorvallis, Oregon, United States of AmericaGraduate Mechanical Engineer - 3D Printing HardwareSant Cugat del Valles, Barcelona, SpainProcess and Tooling EngineerCorvallis, Oregon, United States of AmericaManufacturing EngineerBatu Kawan, Pulau Pinang (Penang), MalaysiaPackaging Design EngineerSingapore, South West, SingaporeElectrical Hardware Engineer, HyperXHsinchu, Hsinchu City, TaiwanMechanical EngineerNess Ziona, Center District, IsraelElectrical Hardware Engineer, HyperXHsinchu, Hsinchu City, TaiwanNew Product Introduction Process/Tooling EngineerCorvallis, Oregon, United States of AmericaMechanical Engineer - (R&D New Product Development)Corvallis, Oregon, United States of AmericaR&D Electrical EngineerSingapore, South West, SingaporeHP Spark Management Associate - Manufacturing Engineer (Penang)Batu Kawan, Pulau Pinang (Penang), MalaysiaHardware Test Lab Engineering and Operations LeadFort Collins, Colorado, United States of AmericaPageWide Web Press Mechanical EngineerCorvallis, Oregon, United States of AmericaManufacturing Engineer 3Batu Kawan, Pulau Pinang (Penang), Malaysia