Physical Design Lead, ASIC

In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.

In this role, you will be empowering Google and our customers with breakthrough capabilities by delivering transformational, co-optimized silicon and technology leadership at scale.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $192000 - $279000 (USD) + 20% bonus target + equity + benefits

Learn more about benefits at Google.

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
  
• 10 years of experience in physical design, including custom structured datapath implementation.
• Experience hardening dense compute units (such as dot-product engines, multiplier-accumulator (MACs), multipliers, or arithmetic logic unit (ALUs) into high-frequency, low-power macros.
• Experience in sub-7nm process nodes (including FinFET and Gate-All-Around architectures), managing the physical density and routing congestion typical of custom datapaths.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with focus on computer architecture.
• Experience in structured placement methodologies (e.g., relative placement, data-flow driven layout, and customized power-grid stitching for dense blocks).
• Experience with tools for logic synthesis, place and route, timing analysis, and design checks for physical and electrical quality; familiarity with tools for schematics, layout, and circuit/logic simulation.
• Experience with physical design and timing, with managing PT-to-PnR timing correlations and metal-fill impacts on dense structures.
• Expert-level scripting versatility (Tcl, Python, Perl) to build layout automation and structural constraints within standard EDA tools.